Pick N Place Siemens – D2-I
The SIPLACE D2 is equipped with
two gantries for speed and flexibility.
Component Size ;01005 – 27 x 27 mm
Two 12-Nozzle Collect & Place Heads
Accuracy up to 50 μm at 3 Sigma
Through put: 31,K per hr
Feeders: 90 – 8 mm feeders
Fine Pitch Placer Siemens –D1-i
Single-gantry solution the new SIPLACE D1/D1s placement machines is equipped with one placement head (as SIPLACE
D1s)
Component Size : 01005 – 200 x 125 mm
Accuracy up to 30 μm at 3 Sigma
Throughput : 15 K per Hr.
Feeders :57 feeders 28 trays.
Vitronics Reflow Oven
- High quality and reliability 9 top and Bottom heaters.
- 3 Cooling Zone.
- Full nitrogen with excellent performance
- Board tracking system
- Auto chain lubrication system
- Fan speed control in two groups Soak/reflow)
- Computer controlled width adjustment
- Precise controlled cooling
- Control accuracy at +/-1°C
- Convection motors and heater
XP-243 -Fine Pitch components Placer
- All the fine Pitch Components BGA, QFN. PLCC placed by this machine.
- This machine can handle Tray, stick, tape components .
- Accuracy and repeatability is good.
- It can Handle 0603 to 50mm x 150mm size components with accuracy.
- Throughput – 6.5K per Hr.
- feeders Capacity :
- 50 nos – 8 mm feeders,
- 20 tray feeders.
CP-6 High speed chip shooter
Throughput – 40k comp per Hr.
Less time for changeover due to 2 device tables
Table Height adjustment made easy
Board Size:
Min.- 80mm x 50mm (3” x 2”)
Max.- 457mm x 356mm (18”x14”)
Thickness – 0.8 – 4 mm
Feeders,
140 8mm feeders/ different components.
Can be use up to 32mm feeders.
Orbotech -AOI
SEHO wave soldering machine.
